Electronics cooling is an area with future high growth potential for OnS. The US alone used 91 billion kWh of electricity on data centres in 2013. This is the same amount of energy generated by 34 large power plants and worth $13Bn . The main reason for the large usage is due to the data centres using air to cool the chips. This is the main technique that is used to cool these electronics chips. 50% of the total energy used in these facilities is used for cooling the server racks.
As processor speeds are increasing the traditional air cooling systems are inadequate and no longer a viable option . The data centre cooling market will be worth £5.4 billion in 2018 as new companies are looking to improve the efficiency of these systems. OnS is planning to work with companies in these new markets to bring improved boiling and therefore cooling performance to the new evaporative and refrigerated cooling systems. Current research is aiming to achieve 3MW/m<sup>2</sup> of cooling power to keep chip temperatures below 85 degrees. To improve the cooling of the servers direct chip cooling and microchannel systems are being investigated but these would be costly to install and difficult to maintain. The improvement of traditional heat exchanger cooling systems could prove to be a more practical and less expensive solution and with the addition of OnS’ coating these could become more efficient and smaller. The coating is also being investigated in microchannel systems to explore whether the implementation could allow these systems to be cheaper and therefore scalable.